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Measurement Tools for Wafer and Semiconductors

Composition Analysis of 2.5D / 3D Packaging | Layer Thickness

Fischer offers clean, fast, precise and reliable EDXRF instruments for layer thickness and composition analysis of advanced 2.5D / 3D packaging solutions. This is available as stand alone or fully automated measurement instruments.

Case Studies

Material Analysis of Solder Bumps in Integrated Circuit Packaging

Products

To the product: FISCHERSCOPE X-RAY XDV-µ SERIES FISCHERSCOPE X-RAY XDV-µ SERIES XRF - Energy dispersive X-ray fluorescence analysis
To the product: FISCHERSCOPE X-RAY XDV-mue SEMI FISCHERSCOPE X-RAY XDV-mue SEMI XRF - Energy dispersive X-ray fluorescence analysis

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