FISCHERSCOPE® X-RAY XDV®-µ
高達
50%
¹性能提升
表現得益於DPP+
表現得益於DPP+
多毛細管光學
內部生產並不斷開發²
內部生產並不斷開發²
3個選項
挑選
合適的多毛細管光學元件³
合適的多毛細管光學元件³
¹ ² ³ 顯示更多
顯示較少
¹DPP+與 DPP 相比，顯著提高了標準偏差，從而提高了測量能力或顯著縮短了測量時間.
² 多毛細管光學元件，正在不斷進一步發展. Fischer 製造的高階毛細管光學元件Fischer 製造的高階毛細管光學元件 - 全球唯一擁有自己的多毛細管生產線的 X 射線螢光測量儀器製造商.
³ 提供三種不同的高階多毛細管 – 適合您每種應用的正確解決方案: 10 µm 無光暈、20 µm 無光暈 或 20 µm 一般.
滿足最小 µ 的最高要求.
FISCHERSCOPE® X-RAY XDV®-µ 儀器是 Fischer 的高階 X 射線螢光測量設備之一，非常適合測量微小結構. 它們配備了最新一代強大的矽漂移偵測器、Ultra 微聚焦管和內部生產的多毛細管光學元件. 由於能量強度高，測量時間大大減少，並且可以在最小的測量點上進行高精度測量.
迎接所有挑戰.
可靠且快速的結果，適用於高要求的測量任務
市場上最先進的多毛細管光學技術.
我們內部製造的多毛細管光學元件可在較短的測量時間內提供出色的測量結果
可編程。
透過先進的圖像識別技術，在預定義的結構上進行自動化測量
全自動化.
只需一鍵點擊即可讓您的儀器為您服務
DPP+ 數位脈衝處理器.
縮短測量時間與改善標準差*
*與DPP 相比
具有 3 倍光學變焦和 WinFTM® 軟體的視訊系統 – 確保每個樣品的精確定位.
使用 Ultra 微聚焦管，激發強度顯著增加. 這確保了以最小的測量點獲得更好的測量性能.
由於創新的多毛細管 X 射線光學元件，該儀器可以使用極小的測量點進行測量，同時保持非常高的強度.
高性能矽漂移偵測器可讓您精確且無損地測量小於 0.1 µm 的最小結構和最薄層.
應用筆記
產品影片
教學
網路研討會
宣傳冊
AN003 High repeatability precision and trueness of Au/Pd coating measurements on leadframes
0.69 MB
AN008 Thickness and composition of NiP on connectors or small structures on PCBs
0.56 MB
AN032 Material analysis of solder bumps in the Integrated circuit (IC) packaging industry
0.57 MB
AN092 How to choose an XRF instrument
1.29 MB
AN093 XRF analysis for non-destructive coating thickness measurement in the field of cold forging
0.75 MB
AN098 Optimized for the electronics industry: Measuring ENIG and ENEPIG on a new level
1.46 MB
AN109 Measuring very thin components and foils with the sample stage Zero Background
0.41 MB
FISCHERSCOPE® X-RAY XDV® series: Up to 50% improved performance
FISCHERSCOPE® X-RAY: Calibration of X-ray measuring instruments
FISCHERSCOPE® X-RAY tutorial: Stability test
FISCHERSCOPE® X-RAY tutorial part 1: Export / Import products in WinFTM®
FISCHERSCOPE® X-RAY tutorial part 2: Export / Import products in WinFTM®
FISCHERSCOPE® X-RAY XDV®-µ: Automated measurements on smallest structures using pattern recognition
FISCHERSCOPE® X-RAY XDV®-µ tutorial part 1: Introduction
FISCHERSCOPE® X-RAY XDV®-µ tutorial part 2: Test of stability, calibration and normalization
FISCHERSCOPE® X-RAY XDV®-µ tutorial part 3: XY programming
Setting up measurement equipment monitoring
Smaller, faster and more precise: Polycapillary optics for challenging applications
Report documentation
應用筆記
AN003 High repeatability precision and trueness of Au/Pd coating measurements on leadframes 0.69 MB AN008 Thickness and composition of NiP on connectors or small structures on PCBs 0.56 MB AN032 Material analysis of solder bumps in the Integrated circuit (IC) packaging industry 0.57 MB AN092 How to choose an XRF instrument 1.29 MB AN093 XRF analysis for non-destructive coating thickness measurement in the field of cold forging 0.75 MB AN098 Optimized for the electronics industry: Measuring ENIG and ENEPIG on a new level 1.46 MB AN109 Measuring very thin components and foils with the sample stage Zero Background 0.41 MB產品影片
FISCHERSCOPE® X-RAY XDV® series: Up to 50% improved performance教學
FISCHERSCOPE® X-RAY: Calibration of X-ray measuring instrumentsFISCHERSCOPE® X-RAY tutorial: Stability testFISCHERSCOPE® X-RAY tutorial part 1: Export / Import products in WinFTM®FISCHERSCOPE® X-RAY tutorial part 2: Export / Import products in WinFTM®FISCHERSCOPE® X-RAY XDV®-µ: Automated measurements on smallest structures using pattern recognitionFISCHERSCOPE® X-RAY XDV®-µ tutorial part 1: IntroductionFISCHERSCOPE® X-RAY XDV®-µ tutorial part 2: Test of stability, calibration and normalizationFISCHERSCOPE® X-RAY XDV®-µ tutorial part 3: XY programming網路研討會
Setting up measurement equipment monitoringSmaller, faster and more precise: Polycapillary optics for challenging applicationsReport documentation宣傳冊
