FISCHERSCOPE® XDV®
Newfaster positioning
faster autofocus
higher camera resolution
¹ In comparison to FISCHERSCOPE® X-RAY XDV®-SDD.
² Depending on the sample surface.
Speed meets precision.
The FISCHERSCOPE® XDV® is a high-end X-ray fluorescence measuring device from Fischer and is ideal for automated measurements on tiny structures. The device impresses with its ease of use, maximum speed and precision. The all-round status lighting shows the current device status at a glance, while the motorized measuring hood can be opened and closed again fully automatically – for safe and convenient operation. The modern FISIQ® X XRF software ensures efficient and smooth processes as well as increased throughput in your measuring process.
High-speed Z-axis.
For fast positioning of your samples
Autofocus under 2 seconds.
Fast acquisition and focusing of your measurement object for even more efficient measurement processes
High-resolution overview camera.
Keep a better overview with sharper and more detailed images
Multi-zone LED lighting.
Perfect illumination at all times, no matter the surface
Automated measurement hood.
Manual or automated operation for maximum flexibility
Optimized measurement geometry.
Unparalleled measurement accuracy thanks to enhanced spacing between X-ray tube, sample, and detector
Intuitive status lighting.
Check the device's status at a glance
Features
Microfocus tube with tungsten anode, other anodes available on request
Automated measuring hood
Silicon drift detector 20 mm² or 50 mm² for highest precision on thin layers
4-fold changeable apertures and 6-fold changeable filters
Type approved full protection device
Software FISIQ® X with AI-supported spectrum mode for smarter measurement processes
Stepless measuring distance with measuring top down
Up to 140 mm possible heights of samples
Programmable measuring table for automated measurements
Application examples
- Analysis of very thin coatings, e.g., gold/palladium coatings of ≤ 50 nm (0.002 mils)
- Measurements of functional coatings in the electronics and semiconductor industries, e.g. determination of the coating thickness of gold layers down to 2 nm (0.00008 mils) for lead frames
- Measurement of ultra-thin coatings on silicon wafers
- Determination of light element coatings on wafers (Al, Ti, NiP)
- Fuel cell and battery foils: metals (Pt, Ir, Ce; Ni, Co, Mn) in organic matrix (carbon)
- Gold analysis with highest requirements
- Determination of complex multi-coating systems
- Automated measurements, e.g. in quality control
Do you have further applications? Then contact us!
































































