FISCHERSCOPE® X-RAY XDAL®
patented DCM method
full protection device
automatable
X-ray fluorescence analysis for higher demands.
Thin, thinner, XDAL®: Thanks to the microfocus tube and various semiconductor detectors, the FISCHERSCOPE® X-RAY XDAL® series is ideal for applications in the field of thin and very thin coatings < 0.05 μm as well as for material analysis in the ppm range. The instrument version with the 50 mm² silicon drift detector is furthermore suitable for RoHS measuring. The flexible and, thanks to various configuration options (table, aperture, filter and detector), universal XDAL® measures reliably, precisely and stands for 100 % safety.
Commissioning.
Extremely fast and simple
One device, many possibilities.
Coating thickness measurement, material analysis and trace analysis
Testing of multiple measuring points.
Even with large samples, measuring points are possible on the entire sample surface
Also for large samples.
Hood with C-slot
Fully automatable.
Let your instrument work for you with just one click
Compact design.
Very good compromise between performance and space requirements
Real-time transmission, evaluation and export of measurement data with WinFTM®, the most powerful application software on the market.
Minimize the risk in incoming goods inspection: eliminate different solder batches thanks to programmable measuring table and semiconductor detector.
It couldn't be more convenient: Stepless measuring distance with a measurement from above and a calibration ex works.
Features
Microfocus tube with tungsten anode
Measuring spot approx.: Ø 0.15 mm
Silicon PIN and silicon drift detector for very good detection accuracy and high resolution
3-fold changeable filters
Type approved full protection device
Determination of metal content in electroplating baths with corresponding accessories
4-fold changeable apertures
Up to 140 mm possible heights of samples
Various measuring table options
Application examples
- Analysis of thin and very thin coatings of ≤ 0.05 μm
- Measuring functional coatings in the electronics and semiconductor industry, such as on lead frames, plug contacts or PCBs
- Determination of complex multilayer systems
- Automated measurements, such as in quality control
- Determination of lead content in solders
- With version SDD (20 mm² or 50 mm²):
- Determination of phosphorus content in NiP layers
- Meets ENIG/ENEPIG requirements
Do you have further applications? Then contact us!
Application Notes
Product videos
Tutorials
Webinars
Brochures
Technical articles
Application Notes
AN001 Au/Pd coatings in the nm range on printed circuit boards 0.48 MB AN068 Determination of Pb in solder alloys for high reliability applications 0.67 MB AN081 Analysing cemented carbide alloys used for making cutting tools 0.50 MB AN092 How to choose an XRF instrument 1.29 MB AN093 XRF analysis for non-destructive coating thickness measurement in the field of cold forging 0.75 MB AN109 Measuring very thin components and foils with the sample stage Zero Background 0.41 MBProduct videos
FISCHERSCOPE® X-RAY XDAL® 237: IntroductionTutorials
FISCHERSCOPE® X-RAY: Calibration of X-ray measuring instrumentsFISCHERSCOPE® X-RAY tutorial: Stability testFISCHERSCOPE® X-RAY tutorial part 1: Export / Import products in WinFTM®FISCHERSCOPE® X-RAY tutorial part 2: Export / Import products in WinFTM®Webinars
Setting up measurement equipment monitoringReport documentationBrochures
Technical articles
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