FISCHERSCOPE X-RAY XDV-µ SERIES

Features

• Powerful premium model for precise coating thickness measurement and material analysis on smallest structures and thinnest coatings < 0.1 µm
• Microfocus tube with tungsten anode; molybdenum anode optional
• 4-fold changeable filter
• Extremely powerful silicon drift detector with 20 mm² or 50 mm² area for highest precision on thin films
• In-house manufactured polycapillary optics for smallest measuring points down to 10 μm FWHM, at short measuring times with high intensity
• Digital pulse processor DPP+ for higher count rates, reduced measuring times or better repeatability of your measurement results
• Analysis of elements from Al(13) to U(92), helium purge available, simultaneous measurement of up to 24 elements
• High precision, programmable XY stage with positioning accuracy of < 5 µm for most accurate sample positioning and automatic pattern recognition, for best repeatability precision

Typical fields of applications

• Measurements on very small flat components and structures such as printed circuit boards, contacts or lead frames
• Measurement of functional coatings in the electronics and semiconductor industry
• Determination of complex multi-coating systems
• Automated measurements, e. g. in quality control
• Measurement of light elements, e. g. determination of the phosphorus content (in ENIG/ENEPIG) under gold and palladium

The FISCHERSCOPE® XDV®-μ spectrometers are Fischer’s high-end X-ray fluorescence (XRF) series, developed for precise layer thickness measurement and material analysis on the tiniest of structures. All units are equipped with a polycapillary optics that focuses the X-ray beam to 10 μm FWHM. The combination of polycapillary and digital pulse processor DPP+ delivers outstanding measurement results and ensures high count rates and even better standard deviations or shorter measurement times. In addition, various filters as well as voltage and current settings allow the best excitation conditions for complex applications with up to 24 elements.
All Fischer XRF instruments are supplied with the proven WinFTM software, the most versatile software on the market. Suitable for many industries and applications, it offers extensive functionalities, for example automatic pattern recognition, guided calibration process or fully customizable reports.

Optimized for the electronics industry: Measuring ENIG and ENEPIG on a new level

The new FISCHERSCOPE® X-RAY XDV®-μ with digital pulse processor DPP+ with its significant performance boost is the optimal solution for measuring electroless nickel/chemical gold (ENIG) or electroless nickel/che­mical palladium/chemical gold (ENEPIG) coatings.

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The FISCHERSCOPE® X-RAY XDV®-µ LD is the industry-leading XRF instrument for connector and electronics applications. The unique 12 mm measurement distance enables measuring complex shaped test parts such as assembled PCBs with a height of 140 mm. Realize the smallest measurement points with excellent stability and high intensity. A large-area silicon drift detector, the Long Distance high-performance capillary and the digital pulse processor DPP+ integrated as standard allow precise, repeatable measurements with high count rates and short measuring times.

Features

• Largest possible measuring distance in its class with 12 mm
• Sample heights up to 14 cm
• Microfocus tube with tungsten anode; molybdenum anode optional
• 4-fold changeable filter
• Extremely powerful silicon drift detector with 50 mm² area for highest precision on thin films
• In-house manufactured polycapillary optics for smallest measuring points 60 μm FWHM, at short measuring times with high intensity
• Digital pulse processor DPP+ for higher count rates, reduced measuring times or better repeatability of your measurement results
• Analysis of elements from S(16) to U(92), helium purge available, simultaneous measurement of up to 24 elements
• High precision, programmable XY stage with positioning accuracy of < 5 µm for most accurate sample positioning and automatic pattern recognition, for best repeatability precision

Typical fields of applications

• Measurements on smallest components and structures such as assembled and complex shaped PCBs, connectors, bond surfaces,SMD components or thin wires
• Measurements of functional coatings in the electronics and semiconductor industries
• Automated measurements, e. g. in quality control
• Determination of complex multi-coating systems

Quality control for press fit pins in the connector industry

The FISCHERSCOPE® X-RAY XDV®-µ LD is a powerful tool to successfully solve the upcoming challenges in the quality control for connector applications.

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Wafers place the highest demands on the measurement technology used. Firstly, the surfaces are very sensitive. Secondly, the structures are so small that only special devices can analyze them. Due to the programmable measuring table with vacuum wafer chuck, the FISCHERSCOPE® X-RAY XDV®-µ WAFER is designed specifically for the semiconductor industry.
The polycapillary optics integrated in the XRF-device focus the X-rays onto smallest measuring spots of 10 or 20 µm at short measuring times with high intensity. Thus, the XDV-µ WAFER allows you to analyze individual microstructures much more precisely than any conventional device can. And of course, this can be done fully automatically.

Features

• Special instrument for automated measurements of thin layers and multi-layer systems on wafers ranging from 6 to 12 inches in diameter
• Microfocus tubes with molybdenum anode, tungsten anode optional
• 4-fold changeable filter
• Polycapillary optics permits particularly small measuring spots of 10 or 20 µm FWHM and optimal local resolution
• Silicon drift detector 20 mm² or 50 mm² for maximum precision on thin layers
• Precise, programmable measuring stage with vacuum wafer chuck for automated measurements on small structures

Typical fields of applications

• Measurements of structures on wafers in the electronics and semiconductor industries, wafer diameters from 6 to 12 inches
• Analysis of very thin coatings, e. g. gold/palladium coatings of ≤ 0.1 µm
• Automated measurements, e. g. in quality control
• Determination of complex multi-coating systems