Say goodbye to positioning errors: With automatic pattern recognition, you inspect your PCBs efficiently and accurately
Measure your contact pads fully automatically in a single run with reliable repeatability and consistent results
Electronic devices are becoming increasingly compact, PCBs are more densely populated than ever, and numerous small contact pads packed into tight spaces need to be reliably tested for solderability and functionality. This puts high demands on quality inspection, including the measurement of coating thickness and material composition on contact pads.
Especially when measuring large-scale PCBs with a high number of measurement points, coordinate-based positioning quickly reaches its limits. Even slight changes in PCB positioning or normal manufacturing tolerances can cause the measurement spot to miss the intended pad and land an adjacent structure instead. The result can be inaccurate measurement data and time-consuming manual adjustments.
For applications like these, our XRF instruments with automatic pattern recognition in our WinFTM® software provide a reliable and highly efficient solution. The pattern recognition function allows you to fully automate your PCB inspection and achieve repeatable measurement results without the risk of positioning errors.
In this Application Note you will learn, among other things:
- why automatic pattern recognition can give you a real competitive edge, especially when inspecting large-format PCBs with a high number of measurement points
- what automatic pattern recognition can do and how to get the most out of it
- which FISCHER instruments support automatic pattern recognition
