With the FISCHERSCOPE® X-RAY XDV®-µ, XDV®-µ LD, XDV®-µ PCB and XDV®-µ WAFER products, the FISCHERSCOPE® X-RAY XDV®-µ series comprises the most powerful XRF analyzers in the Helmut Fischer Group's portfolio. They are now all equipped with the new microfocus tube Ultra as standard for even higher measurement performance with smallest spots. In combination with the powerful digital pulse processor DPP+ for efficient processing of higher count rates and the large-area silicon drift detector (SDD), the devices demonstrate maximum precision even with short measurement times.
Our specialists for microscopic structures
The XDV®-μ series is highly successful on the global market in the field of precise coating thickness measurement and material analysis of highly complex multilayer systems on smallest components and microstructures. While the FISCHERSCOPE® X-RAY XDV®-µ PCB is specialized in PCB and the FISCHERSCOPE® X-RAY XDV®-µ WAFER in wafer measurement, the FISCHERSCOPE® X-RAY XDV®-µ and XDV®-µ LD were developed for coating thickness measurement and material analysis on chip and electronic components such as plug contacts, lead frames, bonding wires, SMD components and solder bumps.
Highest intensity for smallest spots
All devices in the series are equipped as standard with our in-house produced polycapillary optics, which enable tiny measuring spots of down to 10 mm full width at half maximum (FWHM) in combination with maximum intensity. The fact that the excitation unit in the new generation of the FISCHERSCOPE® X-RAY XDV®-µ series with the brand new microfocus tube Ultra has now been decisively optimized is particularly evident in the high-energy range. Smaller measuring spots can now be measured with even higher intensity, which catapults the effectiveness of the measurement into new dimensions. Users from the electronics and semiconductor industry will therefore experience a decisive advantage in the quality inspection of their products as they can now achieve the same precision as with the previous models in an even shorter measuring time.
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