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Significant performance boost for powerful FISCHERSCOPE X-RAY XDV series


Significant performance boost for powerful FISCHERSCOPE X-RAY XDV series

From now on, the FISCHERSCOPEยฎ X-RAY XDVยฎ instruments not only shine in a new design, but also convince with a significant performance boost. A small high-end component with a big effect: Equipped with the new digital pulse processor DPP+, users benefit from an optimization of the measuring precision or the minimization of the measuring time.

Standing still is a step backwards. This principle is firmly anchored in the corporate DNA of Helmut Fischer. The FISCHERSCOPEยฎ X-RAY XDVยฎ-SDD, FISCHERSCOPEยฎ X-RAY XDVยฎ-ยต and FISCHERSCOPEยฎ X-RAY XDVยฎ-ยต LD are the most powerful XRF analyzers in the portfolio of the Sindelfingen-based measurement technology specialist. They are now equipped with the new DPP+ digital pulse processor as standard. The latest generation processor provides count rates at a new level of performance, improving the overall performance of the XRF instruments by up to 50%.  

The polycapillary optics, produced in-house by Fischer, allow tiny measurement spots with short measurement times at high intensity, especially when measuring the smallest components and microstructures. As a result, the highest count rates and optimized spot size are achieved. For users from a wide range of industries, polycapillaries mean significant advantages in terms of measurement precision and measurement time.  

In addition to the technical advancement of the XRF spectrometers, the XDV series convinces with easy operation via joystick and intuitive control buttons directly on the instrument. Equipped with the most versatile software on the market, the instrument series is suitable for a wide range of industries and applications. 


The XDV-SDD is ideally suited for measurements of very thin films <0.05 ยตm and material analysis in the sub-promille range. As a powerful all-rounder, it can be used for a wide range of applications involving gold, NiP or RoHS. Equipped with the new DPP+ pulse processor, the XDV-SDD sets new standards and experiences a significant performance boost. In combination with an advanced silicon drift detector (SDD) and various filter and aperture options, the instrument delivers outstanding measurement results. 


The XDV-ฮผ is designed for precise film thickness measurement and material analysis on tiny structures and flat components, for example lead frames, bonding wires, SMD components or solder bumps. The polycapillary optics focus the X-ray beam on the smallest measuring spots of 60 ฮผm with highest stability and intensity. The combination of powerful polycapillary optics, DPP+ digital pulse processor and a large area silicon drift detector (SDD) enables even higher count rates for precise and repeatable measurements. 


The XDV-ยต LD is the industry-leading XRF instrument for coating thickness measurement and material analysis of connector and electronics applications. The unique 12 mm measurement distance makes it easy to measure complex shaped test parts such as connector contacts and assembled PCBs with a height of 140 mm. With the long-distance polycapillary, the XDV-ยต LD measures the smallest measurement points with excellent stability and intensity. Thanks to the high-performance capillary in combination with the DPP+ digital pulse processor and a large-area silicon drift detector (SDD), users benefit from precise and absolutely reliable measurement results.

For more information, please visit: www.helmut-fischer.com/xdv

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