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ํŠน์ง•

  • Al (13)์—์„œ U (92), XDV-ฮผ LD์—์„œ ์ตœ๋Œ€ 24 ๊ฐœ ์š”์†Œ์˜ ๋™์‹œ ์ธก์ • : S (16) -U (92)
  • ๋งˆ์ดํฌ๋กœ ๊ตฌ์กฐ๋ฌผ์— ๋Œ€ํ•œ ์ธก์ •์„ ์œ„ํ•ด X-ray ๋น”์„ 10ฮผm(FWHM)๊นŒ์ง€ ์ง‘์ค‘์‹œํ‚ค๋Š” ์ฒจ๋‹จ ๊ด‘ํ•™
  • ์—ฌ๋Ÿฌ ์ƒ˜ํ”Œ์—์„œ ์ž๋™ ์ธก์ •์„ ์œ„ํ•œ ํ”„๋กœ๊ทธ๋ž˜๋ฐ ๊ฐ€๋Šฅํ•œ XY ์Šคํ…Œ์ด์ง€ ๋ฐ ํŒจํ„ด ์ธ์‹
  • ์ƒ˜ํ”Œ์„ ์‰ฝ๊ฒŒ ๋ฐฐ์น˜ํ•  ์ˆ˜ ์žˆ๋„๋ก ์ƒ˜ํ”Œ ๋‹จ๊ณ„ ํ™•์žฅ
  • ์นผ๋ฆฌ๋ธŒ๋ ˆ์ด์…˜ ๊ณผ์ •์˜ ๊ฐ€์ด๋“œ
  • ์žฅ๊ธฐ๊ฐ„ ์‚ฌ์šฉํ•˜๊ธฐ์œ„ํ•œ ๊ฒฌ๊ณ ํ•œ ๋””์ž์ธ
  • ๊ด‘ํ•™ ํ˜„๋ฏธ๊ฒฝ(270๋ฐฐ ํ™•๋Œ€) ๋น„๋””์˜ค, ๋ ˆ์ด์ € ํฌ์ธํ„ฐ๋ฅผ ์‚ฌ์šฉํ•˜์—ฌ ์ •ํ™•ํ•œ ์ธก์ • ์ง€์ ์„ ํ‘œ์‹œ
  • ๋ณด์ • ์—†๋Š” ์ธก์ •์„ ์œ„ํ•œ ๊ธฐ๋ณธ ํŒŒ๋ผ๋ฏธํ„ฐ ๋ถ„์„
  • IPC-4552A, 4553A, 4554 and 4556, ASTM B568, ISO 3497 ์ค€์ˆ˜
  • Fischer์˜ ์ธ์ฆ ํ‘œ์ค€์€ ๊ตญ์ œ์ ์œผ๋กœ ๊ณต์ธ๋œ ๊ธฐ๋ณธ ๋‹จ์œ„๋กœ ์ถ”์  ๊ฐ€๋Šฅ

์• ํ”Œ๋ฆฌ์ผ€์ด์…˜

  • ๋งˆ์ดํฌ๋กœ๋ฏธํ„ฐ ๋ฐ ๋‚˜๋…ธ๋ฏธํ„ฐ ๋ฒ”์œ„์˜ Au / Pd / Ni / CuFe ๋ฐ Sn / Ni ์ฝ”ํŒ…
  • ์กฐ๋ฆฝ ๋ฐ ์กฐ๋ฆฝ๋˜์ง€ ์•Š์€ ํšŒ๋กœ๊ธฐํŒ
  • ๋‚˜๋…ธ๋ฏธํ„ฐ ๋ฒ”์œ„์—์„œ base ๊ธˆ์†ํ™” ์ธต(UBM, Under-bump metalization) ์‹œํ—˜
  • ๊ด‘์›์†Œ ์ธก์ •(์˜ˆ: Au ๋ฐ Pd์— ๋”ฐ๋ฅธ ์ธ ํ•จ๋Ÿ‰ ์ธก์ •(ENEPIG ๋ฐ ENIG)
  • Lead-free solder caps on copper pillars
  • ๋ฐ˜๋„์ฒด ์‚ฐ์—…์—์„œ C4 ๋ฐ ์†Œํ˜• ๋•œ๋‚ฉ ์š”์ฒ ๊ณผ ์†Œํ˜• ์ ‘์ด‰ ํ‘œ๋ฉด์˜ ์›์†Œ ์กฐ์„ฑ ํ…Œ์ŠคํŠธ

์†”๋” ๋ฒ”ํ”„? PCB? ๋ฆฌ๋“œ ํ”„๋ ˆ์ž„? ํ•˜๋‚˜์˜ ์ธก์ •๊ธฐ๋กœ ์ด ๋ชจ๋“  ๊ฒƒ์„ ์ธก์ •ํ•˜์‹ญ์‹œ์˜ค!

FISCHERSCOPEยฎ XDVยฎ-ฮผ ์ธก์ •๊ธฐ๋Š” ๊ฐ€์žฅ ์ž‘์€ ๊ตฌ์กฐ๋ฌผ์— ๋Œ€ํ•œ ์ •๋ฐ€ํ•œ ์ธต ๋‘๊ป˜ ์ธก์ • ๋ฐ ์žฌ๋ฃŒ ๋ถ„์„์„ ์œ„ํ•ด ๊ฐœ๋ฐœ๋œ Fischer์˜ ๊ณ ๊ธ‰ X-ray ํ˜•๊ด‘ ์‹œ๋ฆฌ์ฆˆ์ž…๋‹ˆ๋‹ค. ๋ชจ๋“  ์žฅ๋น„์—๋Š” X-ray ๋น”์„ 10ฮผm (FWHM)์— ์ง‘์ค‘์‹œํ‚ค๋Š” Polycaplillary ๊ด‘ํ•™ ์žฅ๋น„๊ฐ€ ์žฅ์ฐฉ๋˜์–ด ์žˆ์Šต๋‹ˆ๋‹ค. Polycaplillary ๊ด‘ํ•™ ์žฅ๋น„๋Š” ๋†’์€ ๋ฐฉ์‚ฌ์„  ๊ฐ•๋„๋ฅผ ์ƒ์„ฑํ•˜์—ฌ ์ฝœ๋ฆฌ๋ฉ”์ดํ„ฐ๊ฐ€์žˆ๋Š” ๊ด‘ํ•™ ์žฅ๋น„์— ๋น„ํ•ด ์ธก์ • ์‹œ๊ฐ„์„ ํฌ๊ฒŒ ์ค„์ž…๋‹ˆ๋‹ค. 

๋ชจ๋“  Fischer XRF ์ธก์ •๊ธฐ์—๋Š” ๋‹ค์šฉ๋„ WinFTM ์†Œํ”„ํŠธ์›จ์–ด๊ฐ€ ์ œ๊ณต๋˜๋ฏ€๋กœ ๋‹ค์–‘ํ•œ ์‘์šฉ ๋ถ„์•ผ๋ฅผ ๋งค์šฐ ์ •ํ™•ํ•˜๊ฒŒ ์ธก์ • ํ•  ์ˆ˜ ์žˆ์Šต๋‹ˆ๋‹ค. ๋˜ํ•œ WinFTM์—๋Š” ํ•œ ๋ฒˆ์˜ ํด๋ฆญ์œผ๋กœ ๊ฐœ๋ณ„ ๋ณด๊ณ ์„œ๋ฅผ ์ž‘์„ฑํ•  ์ˆ˜์žˆ๋Š” ํ†ตํ•ฉ ๋ณด๊ณ ์„œ ์ƒ์„ฑ ๋„๊ตฌ๊ฐ€ ์žˆ์Šต๋‹ˆ๋‹ค. ๋˜ํ•œ, WinFTM ์†Œํ”„ํŠธ์›จ์–ด๋Š” ์บ˜๋ฆฌ๋ธŒ๋ ˆ์ด์…˜์„ ์‰ฌ๊ฒŒ ํ•  ์ˆ˜์žˆ๋Š” ๊ฐ€์ด๋“œ๋ฅผ ์ œ๊ณตํ•ฉ๋‹ˆ๋‹ค. 

XDV-ฮผ ์žฅ๋น„๋Š” ๋‹ค์–‘ํ•œ ํ•„ํ„ฐ, ์ „์•• ๋ฐ ์ „๋ฅ˜ ์„ค์ •๊ณผ ํ•จ๊ป˜ ์ž‘๋™ํ•˜์—ฌ ์ตœ๋Œ€ 24 ๊ฐœ์˜ ์š”์†Œ๊ฐ€ ์žˆ๋Š” ๋ณต์žกํ•œ ์• ํ”Œ๋ฆฌ์ผ€์ด์…˜์—์„œ ๊ฐ€์žฅ ์ ํ•ฉํ•œ ์กฐ๊ฑด์„ ๋งŒ๋“ค ์ˆ˜ ์žˆ์Šต๋‹ˆ๋‹ค. ๋˜ํ•œ XDV-ฮผ์—๋Š” ํ”„๋กœ๊ทธ๋ž˜๋ฐ ๊ฐ€๋Šฅํ•œ XY ์Šคํ…Œ์ด์ง€ ๋ฐ ํŒจํ„ด ์ธ์‹ ์†Œํ”„ํŠธ์›จ์–ด๊ฐ€ ์žˆ์–ด ์—ฌ๋Ÿฌ ์ƒ˜ํ”Œ์—์„œ ๊ฐ€๋Šฅํ•œ ํ•œ ์‰ฝ๊ฒŒ ์ž๋™ ์ธก์ • ํ•  ์ˆ˜ ์žˆ์Šต๋‹ˆ๋‹ค. 

ํ‘œ์ค€ ๋ฒ„์ „์—์„œ XDV-ฮผ์—๋Š” ํ……์Šคํ… X-ray ํŠœ๋ธŒ๊ฐ€ ์žฅ์ฐฉ๋˜์–ด ์ผ๋ฐ˜ ์‘์šฉ ๋ถ„์•ผ์—์„œ ๋†’์€ ์ •๋ฐ€๋„๋ฅผ ์ œ๊ณตํ•ฉ๋‹ˆ๋‹ค. ๋ชฐ๋ฆฌ๋ธŒ๋ด ๋ฐ ํฌ๋กฌ ๋ณ€ํ˜•๋„ ๊ฐ€๋Šฅํ•ฉ๋‹ˆ๋‹ค. 

XDV-ฮผ ์ธก์ •๊ธฐ์—๋Š” ๋Œ€ํ˜• ์‹ค๋ฆฌ์ฝ˜ ๋“œ๋ฆฌํ”„ํŠธ ๊ฒ€์ถœ๊ธฐ (50mmยฒ ์œ ํšจ ์˜์—ญ)์™€ ์ƒˆ๋กœ์šด ๋””์ง€ํ„ธ ํŽ„์Šค ํ”„๋กœ์„ธ์„œ (DPP+)๊ฐ€ ์žฅ์ฐฉ๋˜์–ด ์žˆ์Šต๋‹ˆ๋‹ค. ์ด๋Ÿฌํ•œ ๊ตฌ์„ฑ ์š”์†Œ๋ฅผ ํ•จ๊ป˜ ์‚ฌ์šฉํ•˜๋ฉด ์นด์šดํŠธ ์†๋„๊ฐ€ ๋งค์šฐ ๋†’์•„์„œ ์ธก์ • ์‹œ๊ฐ„์„ ์ตœ์†Œํ™”ํ•˜๋ฉด์„œ ๋ฐ˜๋ณต์„ฑ์„ ์ตœ์ ํ™” ํ•  ์ˆ˜ ์žˆ์Šต๋‹ˆ๋‹ค.

ํŠน์ˆ˜์šฉ๋„๋ฅผ ์œ„ํ•œ ํŠน์ˆ˜ ์ธก์ •๊ธฐ

XDV-ฮผ ์‹œ๋ฆฌ์ฆˆ์—๋Š” ์ „์ž ๋ฐ ๋ฐ˜๋„์ฒด ์‚ฐ์—…์˜ ํŠน์ • ์• ํ”Œ๋ฆฌ์ผ€์ด์…˜์— ๋งž๋Š” ํŠน์ˆ˜ ์žฅ๋น„๊ฐ€ ํฌํ•จ๋˜์–ด ์žˆ์Šต๋‹ˆ๋‹ค. ์˜ˆ๋ฅผ ๋“ค์–ด, XDV-ฮผ LD๋Š” ์กฐ๋ฆฝ ๋œ PCB์˜ ์ธก์ •์— ์ ํ•ฉํ•˜๊ณ  XDV-ฮผ ์›จ์ดํผ์—๋Š” ์ž๋™ ์›จ์ดํผ ์ฒ™์ด ์žˆ์œผ๋ฉฐ XDV-ฮผ LEAD FRAME์€ ๋ฆฌ๋“œ ํ”„๋ ˆ์ž„ ์ฝ”ํŒ… ์ธก์ •์— ์ตœ์ ํ™”๋˜์–ด ์žˆ์Šต๋‹ˆ๋‹ค.

๋” ์ž์„ธํ•œ ์ •๋ณด๋ฅผ ์›ํ•˜์‹ญ๋‹ˆ๊นŒ? ์ง€๊ธˆ ์ƒ˜ํ”Œ์„ ๋ณด๋‚ด๊ฑฐ๋‚˜ XDV-ฮผ ์‹œ๋ฆฌ์ฆˆ์˜ ๋ฌด๋ฃŒ ๋ฐ๋ชจ๋ฅผ ์ค€๋น„ํ•˜์„ธ์š”!

[Translate to Korean:]

We have developed the FISCHERSCOPEยฎ X-RAY XDVยฎ-ยต especially for measuring smallest structures and components with short measuring times. A large-area silicon drift detector and the polycapillary optics enable precise, repeatable measurements e.g. on bond surfaces, SMD components or thin wires. That permits precise quality monitoring of the coatings on printed circuit boards โ€“ and ensures their long-term function.

The FISCHERSCOPEยฎ X-RAY XDVยฎ-ยต LD is your XRF instrument for the measurement of bulky samples. Due to the measuring distance of 12 mm, even assembled PCBs can be measured without any problems.

  • Microfocus tube with tungsten anode; molybdenum anode optionally available
  • Flexible, 4-fold exchangeable primary filter
  • Polycapillary optics for particularly small measuring spots (10 โ€“ 60 ยตm FWHM) with short measuring times
  • Silicon drift detectors with 20 or 50 mmยฒ effective areas
  • Video system with 3ร— optical zoom for precise sample positioning
  • Precise, programmable measuring stage for automated measurements

[Translate to Korean:]

Rely on the specialist for lead frames. With the FISCHERSCOPEยฎ X-RAY XDVยฎ-ยต LEAD FRAME, you can precisely test thin layers and multi layer systems in the nanometer range on very flat micro-electrical components. A typical composition is gold, palladium and nickel on a CuFe substrate. Also, this XRF gauge is perfectly suited for determining the phosphorus content in NiP layers.

The XDV-ยต LEAD FRAME has both interchangeable primary filters and polycapillary optics engineered for low energies. That creates the ideal conditions for the respective measurement.

  • Helium flush allows for measurement of even very light elements starting at sodium
  • Polycapillary optics
  • High-power tubes with chrome anode
  • 4-fold automatically exchangeable filter
  • High-resolution CCD color camera, crosshairs with calibrated scale, adjustable LED illumination and laser pointer (class 1) for exact sample placement
  • Silicon drift detector
  • Fast, programmable XY-stage with pop-out function and electrically driven Z-axis for automated measurements

๋‹ค์šด๋กœ๋“œ

์ด๋ฆ„ ์ข…๋ฅ˜ ์‚ฌ์ด์ฆˆ ๋‹ค์šด๋กœ๋“œ
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