X-ray fluorescence

X-RAY XAN® 500 – the versatile XRF measurement technology
Characteristics
- Mobile X-ray fluorescence device
- Optimized for layer thickness measurement and analysis of alloys
- Tilting protection for measurements with one hand
- Measuring box and tablet with WinFTM software
Your advantages
- Precise layer thickness measurement (e.g., Zn, ZnNi, Ag, Au)
- One device – three application areas: mobile, stationary and inline
- Measure bulky parts with high repeatability
- Placed into the measuring box the XAN 500 turns into a full-function table-top instrument
- Integrated into the control system of a production line, the XAN 500 carries out 100% monitoring
Compact and powerful: the XAN 500 is equipped with a tablet and the WinFTM software
X-RAY XDV®-µ LD
large measuring distance – small measuring spots
Characteristics
- Universal X-ray fluorescence system ideally suited for measuring very thin and complex layer systems
- Large measuring distance (12 mm)
- Micro-focus tube and polycapillary optics provide for very small measurement spots
- Special housing and an extended sample table
Your advantages
- Measurement of samples with complex geometry, e.g. of printed circuit boards
- Very high excitation intensity shortens the measurement time
- Easy handling of large samples like circuit boards
Whether printed circuit boards or connectors: the XDV-µ LD is the right choice for small components with a complex geometry
X-RAY XDV®-µ LEAD FRAME – customized for the electronic industry
Characteristics
- Automated layer thickness measurement and material analysis of conductor tracks, contacts or lead frames
- Analysis in ambient air or with helium purge
- Polycapillary optics for small measuring spots
Your advantages
- Measurement of multi-layer systems and NiP coatings
- Built-in helium purge allows the measurement of very light elements such as sodium
- Also suitable for large printed circuit boards
The XDV®-µ LEAD FRAME covers a very wide range of elements – from sodium (11) to uranium (92).