X-RAY XAN^® 500 – the versatile XRF measurement technology

Characteristics

• Mobile X-ray fluorescence device
• Optimized for layer thickness measurement and analysis of alloys
• Tilting protection for measurements with one hand
• Measuring box and tablet with WinFTM software

Your advantages

• Precise layer thickness measurement (e.g., Zn, ZnNi, Ag, Au)
• One device – three application areas: mobile, stationary and inline
• Measure bulky parts with high repeatability
• Placed into the measuring box the XAN 500 turns into a full-function table-top instrument
• Integrated into the control system of a production line, the XAN 500 carries out 100% monitoring

Compact and powerful: the XAN 500 is equipped with a tablet and the WinFTM software

X-RAY XDV^®-µ LD
large measuring distance – small measuring spots

Characteristics

• Universal X-ray fluorescence system ideally suited for measuring very thin and complex layer systems
• Large measuring distance (12 mm)
• Micro-focus tube and polycapillary optics provide for very small measurement spots
• Special housing and an extended sample table

Your advantages

• Measurement of samples with complex geometry, e.g. of printed circuit boards
• Very high excitation intensity shortens the measurement time
• Easy handling of large samples like circuit boards

Whether printed circuit boards or connectors: the XDV-µ LD is the right choice for small components with a complex geometry

X-RAY XDV^®-µ LEAD FRAME – customized for the electronic industry

Characteristics

• Automated layer thickness measurement and material analysis of conductor tracks, contacts or lead frames
• Analysis in ambient air or with helium purge
• Polycapillary optics for small measuring spots

Your advantages

• Measurement of multi-layer systems and NiP coatings
• Built-in helium purge allows the measurement of very light elements such as sodium
• Also suitable for large printed circuit boards

The XDV^®-µ LEAD FRAME covers a very wide range of elements – from sodium (11) to uranium (92).