Take large-scale PCB inspection to the next level with assembly-line efficiency
Measure even the thinnest coatings and finest structures reliably with short inspection times – without the need for multiple panel repositionings!
As PCB panels become larger and more complex, quality control becomes increasingly challenging. With conventional measurement systems, large panels typically need to be repositioned several times because the entire panel cannot be covered in a single run. This not only increases inspection times, but also introduces the risk of positioning errors. This can have a significant impact on the accuracy and reliability of measurement results, especially when inspecting fine structures and thin coating systems such as ENIG or ENEPIG.
Want to inspect large PCB panels faster without compromising measurement reliability? With the largest measurement area in its class with up to 610 × 610 mm, the FISCHERSCOPE® XDV®-µ PCB XL provides the ideal solution: Simply place your panel on the measurement table, map the XY coordinates, define your measurement points, and start measuring. The panel only needs to be positioned once! Combined with intelligent pattern recognition and scalable automation options, the device enables you to streamline your inspection processes, reduce manual effort, and significantly increase throughput.
In this Application Note you will learn, among other things:
- how to measure ENIG, ENEPIG, and thin nickel coatings with high precision in just a few seconds
- how one-time PCB positioning can reduces inspection times and maximizes your throughput
- how automated pattern recognition helps precisely locate predefined measurement points even when the PCB dimensions vary
- how scalable automation options allow you to adapt the instrument to your production requirements and different inspection workflows
