Semiconductors

As essential components in basic packaging processes, lead frames serve as a mechanical support and electrical connection between the die and the external connections of a housing. They are often coated with complex multilayers. These typically include gold and palladium layers with thicknesses in the nanometer range, whereas the nickel layer is usually several micrometers thick. It is the filigree structure of this lead carrier that makes measurements highly error-prone and complicates quality control. Find out how you can tackle this challenge together with us!

In semiconductor packaging technologies, they serve as basic contact points on a chip, e.g. to attach wires during wire bonding or solder bumps during flip chip packaging. Since landing pads are made of metals such as aluminum, copper, or nickel, they are usually provided with protective or passivation coatings to prevent corrosion and metal diffusion. Are you looking for a fast and reliable measuring solution?

Ball grid arrays (BGAs) are a type of housing for integrated circuits (ICs) and microprocessors used for mounting on PCBs. They offer a high density of connections, which are arranged as a microscopic matrix of solder balls underneath the housing. Discover how our advanced measuring solutions make testing BGAs fast and reliable!

High-quality under bump metallization (UBM) is crucial for the performance and reliability of flip chip connections. It is usually applied to metal pads to ensure better solderability and adhesion of the solder bumps later in the process. In addition, UBM forms a barrier layer against metal diffusion and thus improves the connection between chip and package. Are you ready to discover how our solutions support you in measuring your UBM?

In flip chip or advanced packaging processes, such as wafer-level, 2.5D and 3D packaging technologies, solder bumps, copper pillar bumps and gold bumps are used to connect chips to the substrate or to wafers on a substrate (CoWoS). For proper functionality and cost reasons, the exact material composition – especially the SnAg concentration – of the different types of bumps as well as the coating thickness play a major role. Explore our measuring solutions for this challenge!

Redistribution layers (RDLs) are critical components of wafer-level packaging (WLP), especially in advanced technologies such as Wafer-Level Chip Scale Packaging (WLCSP). They are used to redistribute the connection positions of a chip so that they fit to a standardized layout for different packaging designs. As the conductive tracks in RDLs are mostly made of copper, thin layers of titanium, chrome or nickel are also applied to prevent copper diffusion into the insulating materials and to achieve better adhesion. Want to find out how our measuring solutions help you?

Backside metallization is a key process step in high-power semiconductor and sensor manufacturing, e.g. MEMS sensors. By carefully selecting the layers and their combination sequence, the backside metallization can be optimally matched to the specific requirements of the respective semiconductor component in terms of electrical, mechanical and thermal properties. Are you looking for a measuring solution to test your backside metallizations?

Pogo pins, or spring-loaded pins, are electrical connection mechanisms placed on wafers for wafer testing using probe cards. In this way, the electrical properties of the individual dies on a wafer are tested before they are cut into chips. In order to obtain absolutely reliable results in this testing process, the functional coatings of the pogo pins must be of high quality. This is where our XRF devices come into play. Discover how our advanced measuring solutions make testing pogo pins easy and precise!