Electronics and semiconductors

High-precision measuring solutions for electronics components.

Electronics and semiconductor manufacturing is facing an increasing number of challenges. Increasingly fine structures, miniaturized components and ultra-thin coatings place the highest demands on measuring devices for quality assurance. These must be able to deliver high-precision measurement results down to the nanometer range. Why should you not make any compromises here? The exact layer thicknesses and material properties of coated electronics components play a decisive role in their functionality and performance.

At Fischer, we deal with these challenges and have developed solutions that are specifically tailored to the needs and requirements of the electronics and semiconductor industry. Whether it's PCBs, wafers and semiconductors, pollutant analyses in accordance with RoHS, WEEE, ELV or CPSIA, quality control of electronics components, lead frames or ENIG/ENEPIG coatings – our measuring devices are known for the highest repeatability and guarantee you optimum support for all challenges!

Application examples

Wafers and semiconductors
Electronics components
Lead frames

As carriers for electronics components, PCBs have numerous contact points for electrical connections, all of which are metallically coated. The coating thickness and material composition of the solder tracks determine their conductivity and durability. Our measurement technology specializes in testing the coating quality of both assembled and unassembled PCBs, such as multilayer circuit boards and flex PCBs. Our application notes give you detailed insight into some fields of application. Take a look inside!

Do you have other applications? Then please contact us!

Application Notes

We also offer measuring systems from our Fischer portfolio for the quality assurance of 2.5D and 3D wafer level packaging. Not only coating thickness measurement, but also material analysis are decisive factors for the surface coating of wafers. For example, good solderability and other suitable mechanical properties must be ensured for contacts in IC housings. Solder bumps made from lead-free alloys such as SnAgCu require a precisely dosed material composition.

Our XRF instruments combine outstanding precision with increased efficiency to deliver world-class measurement performance for wafers and semiconductors.

Application Notes

Do you want to detect heavy metals or other harmful substances in your electronics? And do this as uncomplicated and non-destructive as possible, quickly and with high accuracy? May we show you what Fischer measuring devices can do? We offer you absolutely reliable measuring methods with which you can detect even minimal concentrations of harmful substances.

Get optimal support in complying with directives such as RoHS, WEEE, ELV or CPSIA and put your trust in our many years of expertise.

Application Notes

Our wide range of measuring devices covers all requirements in the field of quality control of electronics components. From reliably checking the material properties or layer thickness of lead-free solder during reflow soldering to precisely determining the composition of alloys on SMD components - Fischer has the right solutions for measuring your electronics!

Do you need support with a particularly demanding measuring task? Then please contact us!

Application Notes

In the electronics industry, complex, multilayer coatings are often applied to lead frames, usually consisting of gold, palladium or nickel and each only a few nanometers thick. It is precisely the filigree nature of this lead carrier that makes measurements prone to error and complicates quality control. Use Fischer to reliably determine the coating thickness and composition of the coating systems on your lead frames.

Application Notes

IPC, the global electronics manufacturing association, published the latest version of the IPC-4552 (ENIG / PCB) standard in 2021. The IPC-4552 standard specifies the requirements for the layer thickness of ENIG (Electroless Nickel / Immersion Gold) on PCBs. The wafer-thin gold coating as the final surface is crucial for protecting and maintaining the solderability, wire bondability and conductivity of PCBs during extended storage periods.

In order to ensure compliance with the approval criteria for performance standards according to the IPC-6010 family of guidelines, including IPC-6012, IPC-6013 and IPC-6018, and also to optimize overall product performance, the exact layer thickness of the applied gold must be checked in the final production process – both in the ENIG and the ENEPIG process (Electroless Nickel / Electroless Palladium / Immersion Gold) derived from it. Fischer offers the optimum measurement technology for this.

Did you know that Helmut Fischer, as part of the IPC Plating Subcommittee, is jointly responsible for defining the new IPC-4552B standard? This now also allows Reduction Assisted Immersion Gold (RAIG). As a result, a large number of Fischer XRF instruments also meet the requirements of IPC-4552B.

Application Notes

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